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£75.84
Springer Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)
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Last 67 days • 67 data points (No recent data available)
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Price distribution over 67 days • 2 price levels
Current Price
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Most common price: £76 (34 days, 50.7%)
Price range: £75 - £76
Price levels: 2 different prices over 67 days
Description
This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.
Product Specifications
- Brand
- Springer
- Colour
- White
- Format
- Hardcover
- ASIN
- 9811061645
- Domain
- Amazon UK
- Release Date
- 18 September 2017
- Listed Since
- 06 July 2017
Barcode
No barcode data available
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