Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses) - Image 1

£75.40

Springer Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)

Name: Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)
Brand: Springer
Price: 75.4 GBP
Availability: InStock

White

Mechanics

About as cheap as it gets. The only time it was cheaper was 2 months ago.

£75 today · all-time low £75 (May 2026) · usually £75

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 78 days · 78 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 78 days • 2 price levels

Days at Price

Current Price

Price Analysis

Most common price: £75 (50 days, 64.1%)

Price range: £75 - £76

Price levels: 2 different prices over 78 days

Description

This thesis addresses selected unsolved problems in the chemical mechanical polishing process (CMP) for integrated circuits using ruthenium (Ru) as a novel barrier layer material. Pursuing a systematic approach to resolve the remaining critical issues in the CMP, it first investigates the tribocorrosion properties and the material removal mechanisms of copper (Cu) and Ru in KIO4-based slurry. The thesis subsequently studies Cu/Ru galvanic corrosion from a new micro and in-situ perspective, and on this basis, seeks ways to mitigate corrosion using different slurry additives. The findings presented here constitute a significant advance in fundamental and technical investigations into the CMP, while also laying the groundwork for future research.

Product Specifications

Brand: Springer
Colour: White
Format: hardcover
ASIN: 9811061645
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering > Mechanics
Domain: Amazon UK
Release Date: 18 September 2017
Listed Since: 06 July 2017

Barcode

No barcode data available

Springer Research on Chemical Mechanical Polishing Mechanism of Novel Diffusion Barrier Ru for Cu Interconnect (Springer Theses)

About as cheap as it gets. The only time it was cheaper was 2 months ago.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Handbook of Lapping and Polishing (Manufacturing Engineering and Materials Processing)

Corrosion Control and Surface Finishing: Environmentally Friendly Approaches

Surface Engineering for Corrosion and Wear Resistance

Testing Tribocorrosion of Passivating Materials Supporting Research and Industrial Innovation: A Handbook

Advanced Materials for Interconnections (Volume 66) (European Materials Research Society Symposia Proceedings, Volume 66)

Testing Tribocorrosion of Passivating Materials Supporting Research and Industrial Innovation: A Handbook: 62 (European Federation of Corrosion)

Tribocorrosion: Fundamentals, Methods, and Materials

Woodhead Publishing Surface Coating of Metallic Biomaterials

Advances in Engineering Research: Volume 23 (Advances in Engineering Research Series)

Tribocorrosion of Passive Metals and Coatings (Woodhead Publishing Series in Metals and Surface Engineering)

Multifunctional Materials for Tribological Applications

Bridging the Gap: Corrosion Science For Heritage Contexts: Volume 73 (European Federation of Corrosion (EFC) Series, Volume 73)

Handbook of Smart Coatings for Materials Protection (Woodhead Publishing Series in Metals and Surface Engineering): 64

Chemical-Mechanical Planarization of Semiconductor Materials: 69 (Springer Series in Materials Science, 69)

Environmental Degradation of Metals: Corrosion Technology Series/14

Corrosion Protection and Control Using Nanomaterials (Woodhead Publishing Series in Metals and Surface Engineering)

Electrochemistry for Corrosion Fundamentals (SpringerBriefs in Molecular Science)

Advances in Cmp Polishing Technologies

Lithium Intercalation in Bilayer Graphene Devices (Springer Theses)

Functional Coatings for Corrosion Protection, Volume 2 (Specialty Materials)

Copper, Brass, and Bronze Surfaces: A Guide to Alloys, Finishes, Fabrication, and Maintenance in Architecture and Art (Architectural Metals Series)

Corrosion and Protection of Materials

Korrosion, Passivität und Oberflächenschutz von Metallen