£87.15

Taylor & Francis On-Wafer Calibration Techniques Enabling Accurate Characterization of High-Performance Silicon Devices at the mm-Wave Range and Beyond (River Publishers Series in Electronic Materials and Devices)

Price data last checked 152 day(s) ago - refreshing...

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

It has never been this cheap. We have no record of a lower price.

£87 today · cheaper than every other day in the last 10 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey
↓ Forecast
where the price is heading next
↓ Statistics
all-time high & low, recent range
↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 161 days • 161 data points (No recent data available)

Historical
Generating forecast...
£87.52 £87.11 £87.20 £87.29 £87.38 £87.47 £87.56 01 August 2025 10 September 2025 20 October 2025 29 November 2025 08 January 2026

Price Distribution

Price distribution over 161 days • 1 price levels

Days at Price
161 days 0 40 81 121 161 £87 Days at Price

Price Analysis

Most common price: £87 (161 days, 100.0%)

Price range: £87 - £87

Price levels: 1 different prices over 161 days

Description

The increasing demand for more content, services, and security drives the development of high-speed wireless technologies, optical communication, automotive radar, imaging and sensing systems and many other mm-wave and THz applications. S-parameter measurement at mm-wave and sub-mm wave frequencies plays a crucial role in the modern IC design debug. Most importantly, however, is the step of device characterization for development and optimization of device model parameters for new technologies. Accurate characterization of the intrinsic device in its entire operation frequency range becomes extremely important and this task is very challenging. This book presents solutions for accurate mm-wave characterization of advanced semiconductor devices. It guides through the process of development, implementation and verification of the in-situ calibration methods optimized for high-performance silicon technologies. Technical topics discussed in the book include: Specifics of S-parameter measurements of planar structures Complete mathematical solution for lumped-standard based calibration methods, including the transfer Thru-Match-Reflect (TMR) algorithms Design guideline and examples for the on-wafer calibration standards realized in both advanced SiGe BiCMOS and RF CMOS processes Methods for verification of electrical characteristics of calibration standards and accuracy of the in-situ calibration results Comparison of the new technique vs. conventional approaches: the probe-tip calibration and the pad parasitic de-embedding for various device types, geometries and model parameters New aspects of the on-wafer RF measurements at mmWave frequency range and calibration assurance.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 July 2019
Listed Since
08 May 2019

Barcode

No barcode data available

Similar Products You Might Like

RF Measurements of Die and Packages (Microwave Library)
97% match

RF Measurements of Die and Packages (Microwave Library)

Artech House

£91.00 03 Mar 2026
RF Measurements of Die and Packages
96% match

RF Measurements of Die and Packages

Artech House

£91.00 08 Mar 2026
Radio Frequency Integrated Circuits and Technologies
96% match

Radio Frequency Integrated Circuits and Technologies

Springer

£62.02 29 Jan 2026
Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation
96% match

Microwave and Millimeter-Wave Chips Based on Thin-Film Integrated Passive Device Technology: Design and Simulation

£104.86 13 Jan 2026
High-Frequency Characterization of Electronic Packaging: 1 (Electronic Packaging and Interconnects, 1)
96% match

High-Frequency Characterization of Electronic Packaging: 1 (Electronic Packaging and Interconnects, 1)

Springer

£77.75 15 Apr 2026
mm-Wave Silicon Technology: 60 GHz and Beyond (Integrated Circuits and Systems)
96% match

mm-Wave Silicon Technology: 60 GHz and Beyond (Integrated Circuits and Systems)

Springer

£162.21 12 Jan 2026
Wireless Technologies: Circuits, Systems, and Devices (Devices, Circuits, and Systems)
96% match

Wireless Technologies: Circuits, Systems, and Devices (Devices, Circuits, and Systems)

CRC Press

£166.98 12 Dec 2025
Scaling and Integration of High-Speed Electronics and Optomechanical Systems: 59 (Selected Topics in Electronics and Systems)
96% match

Scaling and Integration of High-Speed Electronics and Optomechanical Systems: 59 (Selected Topics in Electronics and Systems)

World Scientific Publishing Company

£63.64 09 Mar 2026
Analysis and Simulation of Heterostructure Devices (Computational Microelectronics)
96% match

Analysis and Simulation of Heterostructure Devices (Computational Microelectronics)

Springer

£109.93 07 Jan 2026
Integrated Microsystems: Electronics, Photonics, and Biotechnology (Devices, Circuits, and Systems)
96% match

Integrated Microsystems: Electronics, Photonics, and Biotechnology (Devices, Circuits, and Systems)

CRC Press

£95.42 01 Mar 2026
Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)
96% match

Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications: 2 (Electronic Packaging and Interconnects, 2)

Springer

£75.03 30 Jan 2026
3D and Circuit Integration of MEMS
96% match

3D and Circuit Integration of MEMS

Wiley

£101.66 09 Jan 2026
Selected Advances in Nanoelectronic Devices: Logic, Memory and RF: 175 (Lecture Notes in Electrical Engineering, 175)
96% match

Selected Advances in Nanoelectronic Devices: Logic, Memory and RF: 175 (Lecture Notes in Electrical Engineering, 175)

Springer

£75.84 09 Mar 2026
Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials
96% match

Design of CMOS Millimeter-Wave and Terahertz Integrated Circuits with Metamaterials

CRC Press

£120.00 17 Mar 2026
VCSEL Industry: Communication and Sensing (The ComSoc Guides to Communications Technologies)
96% match

VCSEL Industry: Communication and Sensing (The ComSoc Guides to Communications Technologies)

Wiley-IEEE Press

£82.89 05 Feb 2026
Wireless Interface Technologies for 3D IC and Module Integration
96% match

Wireless Interface Technologies for 3D IC and Module Integration

Cambridge University Press

£96.84 16 Apr 2026
Advances in Infrared Photodetectors: 84 (Semiconductors and Semimetals): Volume 84
95% match

Advances in Infrared Photodetectors: 84 (Semiconductors and Semimetals): Volume 84

Academic Press

£157.59 18 Feb 2026
Metamaterial Surface Plasmon-Based Transmission Lines and Antennas (Springer Theses)
95% match

Metamaterial Surface Plasmon-Based Transmission Lines and Antennas (Springer Theses)

Springer

£69.84 11 Apr 2026
Emerging Trends in Terahertz Engineering and System Technologies: Devices, Materials, Imaging, Data Acquisition and Processing
95% match

Emerging Trends in Terahertz Engineering and System Technologies: Devices, Materials, Imaging, Data Acquisition and Processing

Springer

£87.99 05 Apr 2026
IC Design Insights - from Selected Presentations at CICC 2017 (Tutorials in Solid-State Circuits)
95% match

IC Design Insights - from Selected Presentations at CICC 2017 (Tutorials in Solid-State Circuits)

Taylor & Francis

£79.06 30 Jan 2026
Ultra High-Speed CMOS Circuits: Beyond 100 GHz
95% match

Ultra High-Speed CMOS Circuits: Beyond 100 GHz

Springer

£91.82 18 Apr 2026
Magnetism in Topological Insulators
95% match

Magnetism in Topological Insulators

Springer

£87.93 13 Apr 2026
Mixed-Signal CMOS for Wireline Communication: Transistor-Level and System-Level Design Considerations
95% match

Mixed-Signal CMOS for Wireline Communication: Transistor-Level and System-Level Design Considerations

Cambridge University Press

£86.59 18 Mar 2026
Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... ... Physical Design - Reliability and Packaging
95% match

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... ... Physical Design - Reliability and Packaging

Springer

£100.65 13 Dec 2025