Wireless Interface Technologies for 3D IC and Module Integration - Image 1

£96.84

Cambridge University Press Wireless Interface Technologies for 3D IC and Module Integration

Name: Wireless Interface Technologies for 3D IC and Module Integration
Brand: Cambridge University Press
Price: 96.83 GBP
Availability: InStock

Circuits

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Description

Product Description Synthesising fifteen years of research, this authoritative text provides a comprehensive treatment of two major technologies for wireless chip and module interface design, covering technology fundamentals, design considerations and tradeoffs, practical implementation considerations, and discussion of practical applications in neural network, reconfigurable processors, and stacked SRAM. It explains the design principles and applications of two near-field wireless interface technologies for 2.5-3D IC and module integration respectively, and describes system-level performance benefits, making this an essential resource for researchers, professional engineers and graduate students performing research in next-generation wireless chip and module interface design. Book Description Synthesising fifteen years of research, this text provides a comprehensive treatment of two major technologies for wireless chip and module interface design. About the Author Tadahiro Kuroda is Professor and Founding Director at the Systems Design Lab at the University of Tokyo. He is a Fellow of the IEICE and the IEEE.Wai-Yeung Yip is a Researcher at the University of Tokyo with over twenty-five years of industry experience in high-speed chip interface design.

Product Specifications

Brand: Cambridge University Press
Format: hardcover
ASIN: 110884121X
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Circuits
Domain: Amazon UK
Release Date: 30 September 2021
Listed Since: 22 March 2021

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Cambridge University Press Wireless Interface Technologies for 3D IC and Module Integration

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