Price loading...

SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)

Power Generation & Distribution

Price data last checked 103 day(s) ago - refreshing...

View at Amazon

Price History & Forecast

No Price Data Available

Price history will appear here once data is collected from Amazon.

Price Distribution

No price data available for histogram

Description

High-frequency switching power semiconductor devices are at the heart of power electronic converters. To date, these devices have been dominated by the well-established silicon (Si) technology. However, their intrinsic physical limits are becoming a barrier to achieving higher performance power conversion. Wide Bandgap (WBG) semiconductor devices offer the potential for higher efficiency, smaller size, lighter weight, and/or longer lifetime. Applications in power grid electronics as well as in electromobility are on the rise, but a number of technological bottle-necks need to be overcome if applications are to become more widespread - particularly packaging. This book describes the development of advanced multi-chip packaging solutions for novel WBG semiconductors, specifically silicon carbide (SiC) power MOSFETs. Coverage includes an introduction; multi-chip power modules; module design and transfer to SiC technology; electrothermal, thermo-mechanical, statistical and electromagnetic aspects of optimum module design; high temperature capable SiC power modules; validation technologies; degradation monitoring; and emerging packaging technologies. The book is a valuable reference for researchers and experts in academia and industry.

Product Specifications

Format: hardcover
ASIN: 1785619071
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electrical > Power Generation & Distribution
Domain: Amazon UK
Release Date: 03 February 2022
Listed Since: 03 March 2021

Barcode

No barcode data available

SiC Power Module Design: Performance, robustness and reliability (Energy Engineering)

Price History & Forecast

No Price Data Available

Price Distribution

Description

Product Specifications

Barcode

Similar Products You Might Like

Modern Power Electronic Devices: Physics, applications, and reliability (Energy Engineering)

Characterization of Wide Bandgap Power Semiconductor Devices (Energy Engineering)

Fundamentals of Silicon Carbide Technology: Growth, Characterization, Devices and Applications (IEEE Press)

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability (Woodhead Publishing Series in Electronic and Optical Materials)

Power Microelectronics: Device and Process Technologies (Second Edition)

Power Electronic Modules: Design and Manufacture

POWER MICROELECTRONICS: DEVICE AND PROCESS TECHNOLOGIES

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Power Electronic Packaging: Design, Assembly Process, Reliability and Modeling

Wide Bandgap Semiconductors for Power Electronics: Materials, Devices, Applications

Design of Power Management Integrated Circuits (IEEE Press)

Managing Power Electronics: VLSI and DSP-Driven Systems

Semiconductor Power Devices: Physics, Characteristics, Reliability

Silicon Carbide Devices and Technology

Power Electronic Converters and Systems: Converters and machine drives (Volume 1) (Energy Engineering)

Power Electronic Converters and Systems: Applications (Volume 2) (Energy Engineering)

Fundamentals of Power Integrity for Computer Platforms and Systems

Advanced Ultra Low-Power Semiconductor Devices: Design and Applications

Semiconductor Advanced Packaging

Wiley-Blackwell Advanced Electronic Packaging Book

Wiley Quality Conformance of Microelectronic Packages Book

Power GaN Devices: Materials, Applications and Reliability (Power Electronics and Power Systems)

Modeling And Electrothermal Simulation Of SiC Power Devices: Using Silvaco© Atlas

Wiley System Integration: Transistor Design to IC Circuits