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McGraw-Hill Education BALL GRID ARRAY TECHNOLOGY (Electronic Packaging and Interconnection Series)

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Description

This text covers ball grid array (BGA) design and manufacturing. BGA is a relatively new way of connecting leads from an integrated circuit package to a printed circuit board, allowing a higher pin count and function density than other connection methods and giving the lowest signal delay. These features make it an important component of modern high performance systems, but the density of leads makes manufacturing and process control very difficult.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 January 1995
Listed Since
17 October 2006

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