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Springer Copper Wire Bonding - Springer Engineering Technology Book

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£92.22 £87.61 £89.45 £91.30 £93.14 £94.99 £96.83 11 August 2026 19 August 2026 27 August 2026 04 September 2026 12 September 2026
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Description

This comprehensive volume examines copper wire bonding technologies, processes, and equipment, addressing the electronics industry's shift from gold to copper bonding materials driven by cost reduction. The book analyses the economic benefits and risks of this transition, whilst thoroughly exploring the process and reliability challenges that arise from copper's material properties. It provides detailed insights into the technical hurdles of replacing gold with copper as a wire bond material, making it an essential reference for engineers, manufacturers, and professionals involved in semiconductor assembly and electronic component production.

Key Features

Copper Wire Bonding by Springer covers in-depth technologies and processes for modern wire bonding applications in electronics manufacturing.

The book examines economic benefits and cost savings achieved through transitioning from gold to copper bonding materials.

Detailed analysis of process challenges and reliability concerns specific to copper wire bonding in semiconductor assembly.

Engineering reference material addressing material properties and technical hurdles of copper as a wire bond replacement.

Comprehensive guide to copper wire bonding equipment selection and operational best practices for electronics manufacturers.

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
23 August 2016
Listed Since
04 August 2016

Barcode

No barcode data available

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