£14.24

MG Chemicals 8341 No Clean Soldering Flux Paste - 49g Jar

Clear, 8341-50ML

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£14 today · previous high £14 · all-time low £13

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Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 55 days · 55 data points (no recent data)

Historical
Generating forecast…
£14.24 £13.17 £13.41 £13.64 £13.87 £14.10 £14.34 26 April 2026 09 May 2026 23 May 2026 05 June 2026 19 June 2026

Price Distribution

Price distribution over 55 days • 2 price levels

Days at Price
Current Price
18 days 37 days · current 0 9 19 28 37 £13 £14 Days at Price

Price Analysis

Most common price: £14 (37 days, 67.3%)

Price range: £13 - £14

Price levels: 2 different prices over 55 days

Description

Improve your electronics repair and touch up processes with MG Chemicals 8341 No Clean Soldering Flux Paste. This high-performance thixotropic paste is specifically formulated for surface mount assemblies (SMD) and PCB work. It features a unique mixture of high-grade synthetic resin and thixotropic agents that work effectively with both high-temperature lead-free alloys and conventional Sn/Pb solder systems. Designed for efficiency, this flux provides excellent wetting activity to ensure fast wetting action and maximum spread across your components. Because it is a no-clean formulation, the resulting residues do not require removal for most applications, saving you time during complex assembly tasks. The residue is non-conductive, non-corrosive, and moisture resistant, making it a reliable choice for professional and DIY electronics work. Whether you are working on precision SMD components or general PCB repairs, this 49.0g jar provides the consistency and quality needed for professional results.

Key Features

Superior fluxing ability promotes fast wetting action and maximum wetting spread for high-quality solder joints.

No-clean formulation leaves non-conductive, non-corrosive, and moisture-resistant residues that do not require removal.

Compatible with both lead-free and leaded solder systems, making it versatile for various electronics repair needs.

Thixotropic paste consistency is ideal for precision touch ups and repairs of surface mount (SMD) assemblies.

RoHS compliant formula ensures it meets industry standards for electronic manufacturing and safety.

Non-tacky residue ensures clean-looking boards after the soldering process is complete.

Product Specifications

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