£104.29

Cheaper than 54% of the days we've watched it.

£104 today · 30-day average £118 · all-time low £93

Elsevier WBG Power Semiconductor Packaging Book

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Price History & Forecast

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Last 87 days · 87 data points (no recent data)

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£164.99 £85.80 £103.08 £120.36 £137.63 £154.91 £172.19 11 August 2026 01 September 2026 23 September 2026 14 October 2026 05 November 2026
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Price distribution over 87 days • 4 price levels

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40 days 21 days · current 13 days 13 days 0 10 20 30 40 £93 £104 £136 £165 Days at Price

Price Analysis

Most common price: £93 (40 days, 46.0%)

Price range: £93 - £165

Price levels: 4 different prices over 87 days

Description

Wide Bandgap Power Semiconductor Packaging: Materials, Components, and Reliability provides a technical deep dive into the integration challenges facing WBG power semiconductors. This Elsevier publication addresses critical issues such as heat resistance, thermal stress, and heat dissipation. Readers will find expert research on noise reduction at high frequencies and solutions for discrete components. The text covers essential topics including metallization, plating, bonding, wiring, and interfacing. By presenting the latest methods for reliability and evaluation, this book offers the technical knowledge needed to advance WBG power semiconductor integration and component performance.

Key Features

Covers key integration challenges including heat resistance and thermal stress for WBG power semiconductors.

Provides expert research on noise reduction at high frequencies and discrete components.

Explores technical solutions for metallization, plating, bonding, and wiring processes.

Discusses materials, components, and methods for the reliability and evaluation of WBG power semiconductors.

Offers insights into interfacing and heat dissipation to improve semiconductor integration.

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