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DEStech Publications, Inc DEStech Thermal Conductivity 31/Thermal Expansion 19 Proceedings

Name: DEStech Thermal Conductivity 31/Thermal Expansion 19 Proceedings
Brand: DEStech Publications, Inc
Price: 141.0 GBP
Availability: OutOfStock

Materials Science

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Description

Access specialized research through the proceedings of the 31st International Thermal Conductivity Conference and the 19th International Thermal Expansion Symposium. Published by DEStech Publications, Inc., this volume serves as a comprehensive resource for professionals and academics working within the fields of materials science and mechanical engineering. This collection gathers technical insights and findings from these significant international gatherings. It is designed for researchers, engineers, and students who require detailed information regarding thermal properties and expansion characteristics of various materials. By providing a centralized record of these symposia, the book supports advanced study and practical application in engineering and technology sectors. Whether you are conducting laboratory research or applying thermal science to industrial design, these proceedings offer a documented foundation of international expertise. This publication is a valuable addition to any technical library focused on materials science and engineering technology.

Key Features

Includes proceedings from the 31st International Thermal Conductivity Conference for in-depth research access.

Contains documentation from the 19th International Thermal Expansion Symposium to support thermal study.

Published by DEStech Publications, Inc. to ensure professional standards for technical literature.

Targeted at specialists in materials science, mechanical engineering, and engineering technology.

Provides a compiled resource of international scientific findings and technical discussions.

Product Specifications

Brand: DEStech Publications, Inc
Format: hardcover
ASIN: 1605950556
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Mechanical & Materials Engineering > Materials Science
Domain: Amazon UK
Release Date: 30 September 2013
Listed Since: 30 November 2012

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DEStech Publications, Inc DEStech Thermal Conductivity 31/Thermal Expansion 19 Proceedings

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