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DEStech Publications, Inc DEStech Thermal Conductivity 31/Thermal Expansion 19 Proceedings
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Description
Key Features
Includes proceedings from the 31st International Thermal Conductivity Conference for in-depth research access.
Contains documentation from the 19th International Thermal Expansion Symposium to support thermal study.
Published by DEStech Publications, Inc. to ensure professional standards for technical literature.
Targeted at specialists in materials science, mechanical engineering, and engineering technology.
Provides a compiled resource of international scientific findings and technical discussions.
Product Specifications
- Format
- hardcover
- ASIN
- 1605950556
- Domain
- Amazon UK
- Release Date
- 30 September 2013
- Listed Since
- 30 November 2012
Barcode
No barcode data available
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