ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 1: COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH - Image 1

£315.31

World Scientific Publishing Company ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 1: COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH

Name: ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 1: COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH
Brand: World Scientific Publishing Company
Price: 315.31 GBP
Availability: InStock

Civil Engineering

Price data last checked 17 day(s) ago - will refresh soon

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

About as cheap as it gets. The only time it was cheaper was 3 months ago.

£315 today · all-time low £315 (Jun 2026) · usually £315

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 74 days · 74 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 74 days • 1 price levels

Days at Price

Price Analysis

Most common price: £315 (74 days, 100.0%)

Price range: £315 - £315

Price levels: 1 different prices over 74 days

Description

Thermal and mechanical packaging - the enabling technologies for the physical implementation of electronic systems - are responsible for much of the progress in miniaturization, reliability, and functional density achieved by electronic, microelectronic, and nanoelectronic products during the past 50 years. The inherent inefficiency of electronic devices and their sensitivity to heat have placed thermal packaging on the critical path of nearly every product development effort in traditional, as well as emerging, electronic product categories.Successful thermal packaging is the key differentiator in electronic products, as diverse as supercomputers and cell phones, and continues to be of pivotal importance in the refinement of traditional products and in the development of products for new applications. The Encyclopedia of Thermal Packaging, compiled in four multi-volume sets (Set 1: Thermal Packaging Techniques, Set 2: Thermal Packaging Tools, Set 3: Thermal Packaging Applications, and Set 4: Thermal Packaging Configurations) will provide a comprehensive, one-stop treatment of the techniques, tools, applications, and configurations of electronic thermal packaging. Each of the author-written sets presents the accumulated wisdom and shared perspectives of a few luminaries in the thermal management of electronics.Set 2: Thermal Packaging ToolsThe second set in the encyclopedia, Thermal Packaging Tools, includes volumes dedicated to thermal design of data centers, techniques and models for the design and optimization of heat sinks, the development and use of reduced-order “compact” thermal models of electronic components, a database of critical material thermal properties, and a comprehensive exploration of thermally-informed electronic design. The numerical and analytical techniques described in these volumes are among the primary tools used by thermal packaging practitioners and researchers to accelerate product and system development and achieve “correct by design” thermal packaging solutions.The four sets in the Encyclopedia of Thermal Packaging will provide the novice and student with a complete reference for a quick ascent on the thermal packaging ';learning curve,'; the practitioner with a validated set of techniques and tools to face every challenge, and researchers with a clear definition of the state-of-the-art and emerging needs to guide their future efforts. This encyclopedia will, thus, be of great interest to packaging engineers, electronic product development engineers, and product managers, as well as to researchers in thermal management of electronic and photonic components and systems, and most beneficial to undergraduate and graduate students studying mechanical, electrical, and electronic engineering.

Product Specifications

Brand: World Scientific Publishing Company
Format: hardcover
ASIN: 9814327638
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Civil Engineering
Domain: Amazon UK
Release Date: 18 December 2014
Listed Since: 13 August 2021

Barcode

No barcode data available

World Scientific Publishing Company ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 1: COOLING OF MICROELECTRONIC AND NANOELECTRONIC EQUIPMENT: ADVANCES AND EMERGING RESEARCH

About as cheap as it gets. The only time it was cheaper was 3 months ago.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 1: THERMAL PACKAGING TECHNIQUES - VOLUME 6: EXPERIMENTAL THERMOFLUID CHARACTERIZATION OF ELECTRONIC COMPONENTS

ENCYCLOPEDIA OF THERMAL PACKAGING, SET 2: THERMAL PACKAGING TOOLS - VOLUME 2: ENERGY OPTIMIZATION AND THERMAL MANAGEMENT OF DATA CENTERS

Encyclopedia Of Thermal Packaging, Set 2: Thermal Packaging Tools - Volume 4: Thermally-informed Design Of Microelectronic Components

Encyclopedia of Thermal Packaging: Set 2: Thermal Packaging Tools: Set 2: Thermal Packaging Tools (A 4-Volume Set)

Encyclopedia Of Thermal Packaging, Set 1: Thermal Packaging Techniques (A 6-Volume Set)

Thermal Management for Opto-electronics Packaging and Applications

Thermal design, simulation, and sensing of electronic products

The 2016 Report on Electronic Thermal Management Systems: World Market Segmentation by City

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS: PHASE CHANGE MATERIAL BASED HYBRID THERMAL MANAGEMENT OF ELECTRONIC COMPONENTS AND SYSTEMS

Engineering Thermodynamics: Advanced Modeling of Energy Systems and Nuclear Cycles, Two-Volume Set

The 2013-2018 Outlook for Electronic Thermal Management Systems in The Middle East

The 2013-2018 Outlook for Advanced Electronic Packaging in India

The 2013-2018 Outlook for Advanced Electronic Packaging in Europe

McGraw-Hill Thermodynamics: An Engineering Approach - 7th Ed

Thermal Engineering

The 2016 Report on Advanced Electronic Packaging: World Market Segmentation by City

The 2016-2021 Outlook for Thermal Management Technologies in the United States

The 2023 Report on Thermal Energy Storage Technologies: World Market Segmentation by City

Thermodynamics Made Simple for Energy Engineers: & Engineers in Other Disciplines

Advances in Thermal System, Materials and Design Engineering

Thermal Energy Systems: Design, Computational Techniques, and Applications (Advances in Manufacturing, Design and Computational Intelligence Techniques)

Proceedings of the International Electronic Packaging Conference: Interpack 95 (EEP): Interpack 95 (EEP)

The 2016-2021 Outlook for Advanced Electronic Packaging in Japan