£205.47

Springer Big Data Analyses, Services, and Smart Data: 899 (Advances in Intelligent Systems and Computing, 899)

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Product Description This book covers topics like big data analyses, services, and smart data. It contains (i) invited papers, (ii) selected papers from the Sixth International Conference on Big Data Applications and Services (BigDAS 2018), as well as (iii) extended papers from the Sixth IEEE International Conference on Big Data and Smart Computing (IEEE BigComp 2019). The aim of BigDAS is to present innovative results, encourage academic and industrial interaction, and promote collaborative research in the field of big data worldwide. BigDAS 2018 was held in Zhengzhou, China, on August 19–22, 2018, and organized by the Korea Big Data Service Society and TusStar. The goal of IEEE BigComp, initiated by Korean Institute of Information Scientists and Engineers (KIISE), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in the emerging fields of big data and smart computing. IEEE BigComp 2019 was held in Kyoto, Japan, on February 27–March 02, 2019, and co-sponsored by IEEE and KIISE. From the Back Cover This book covers topics like big data analyses, services, and smart data. It contains (i) invited papers, (ii) selected papers from the Sixth International Conference on Big Data Applications and Services (BigDAS 2018), as well as (iii) extended papers from the Sixth IEEE International Conference on Big Data and Smart Computing (IEEE BigComp 2019). The aim of BigDAS is to present innovative results, encourage academic and industrial interaction, and promote collaborative research in the field of big data worldwide. BigDAS 2018 was held in Zhengzhou, China, on August 19–22, 2018, and organized by the Korea Big Data Service Society and TusStar. The goal of IEEE BigComp, initiated by Korean Institute of Information Scientists and Engineers (KIISE), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in the emerging fields of big data and smart computing. IEEE BigComp 2019 was held in Kyoto, Japan, on February 27–March 02, 2019, and co-sponsored by IEEE and KIISE. About the Author Prof. Wookey Lee.  He received his B.S., M.S., and Ph.D. degrees from Seoul National University, South Korea, and his M.S.E. degree from Carnegie Mellon University, USA. Currently, he is the director of VOICE AI institute and a professor at Inha University, South Korea, and has been a visiting professor in Dept. of Computer Science, University of British Columbia, Canada. He won the best paper awards in IEEE TCSC, KORMS, KOSIPER, and KIISE. He currently is the editor-in-chief of the Journal of Information Technology and Architecture, and Journal of Big Data Service, also an associate editor of World Wide Web Journal, Supercomputing, Cluster Computing, Sensors, etc. He has served as the president of Korea DataBase Society and an executive committee member of IEEE TCDE. He has participated as a steering committee of BigComp, and a PC member for APWeb, BigComp, CIKM, IEEE DEST, iiWAS, ITA, and WAIM, and an Organizing Committee member for DASFAA, EA, SRDS, and VLDB, etc. His research interests are Deep Learning, graph search, Voice-informatics, patent information, mobile and Data Warehousing, etc. Carson Leung is currently a Full Professor at the University of Manitoba, Canada. He obtained his B.Sc. (Hons.), M.Sc. and Ph.D. from the University of British Columbia, Canada. He has published more than 250 papers on the topics of databases, data mining, big data computing, social network analysis, as well as visual analytics―including papers in ACM Transactions on Database Systems (TODS), Social Network Analysis and Mining (SNAM), Future Generation Computer Systems (FGCS), Journal of Organizational Computing and Electronic Commerce (JOCEC), IEEE International Conference on Data Engineering (ICDE), I

Product Specifications

Format
Paperback
Domain
Amazon UK
Release Date
12 September 2021
Listed Since
15 August 2021

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