Springer Machine Intelligence and Signal Processing: Proceedings of International Conference, MISP 2019: 1085 (Advances in Intelligent Systems and Computing, 1085)

This book features selected high-quality research papers presented at the International Conference on Machine Intelligence and Signal Processing (MISP 2019), held at the Indian Institute of Technology, Allahabad, India, on September 7–10, 2019. The book covers the latest advances in the fields of machine learning, big data analytics, signal processing, computational learning theory, and their real-time applications. The topics covered include support vector machines (SVM) and variants like least-squares SVM (LS-SVM) and twin SVM (TWSVM), extreme learning machine (ELM), artificial neural network (ANN), and other areas in machine learning. Further, it discusses the real-time challenges involved in processing big data and adapting the algorithms dynamically to improve the computational efficiency. Lastly, it describes recent developments in processing signals, for instance, signals generated from IoT devices, smart systems, speech, and videos and addresses biomedical signal processing: electrocardiogram (ECG) and electroencephalogram (EEG). From the Back Cover This book features selected high-quality research papers presented at the International Conference on Machine Intelligence and Signal Processing (MISP 2019), held at the Indian Institute of Technology, Allahabad, India, on September 7–10, 2019. The book covers the latest advances in the fields of machine learning, big data analytics, signal processing, computational learning theory, and their real-time applications. The topics covered include support vector machines (SVM) and variants like least-squares SVM (LS-SVM) and twin SVM (TWSVM), extreme learning machine (ELM), artificial neural network (ANN), and other areas in machine learning. Further, it discusses the real-time challenges involved in processing big data and adapting the algorithms dynamically to improve the computational efficiency. Lastly, it describes recent developments in processing signals, for instance, signals generated from IoT devices, smart systems, speech, and videos and addresses biomedical signal processing: electrocardiogram (ECG) and electroencephalogram (EEG). About the Author Dr. Sonali Agarwal is Associate Professor at Indian Institute of Information Technology Allahabad, Prayagraj, U.P., India. Her main research areas are data mining, software engineering and machine learning. She has published several research papers in academic journals and international proceedings. She has served as a guest editor for special issues in several journals, program committee member for many conferences and chaired several conferences. She also organized several national/international workshops and conferences. She is a senior member of IEEE and a member of IEEE CIS and ACM. Prof. Shekhar Verma is a Professor at Indian Institute of Information Technology Allahabad, Prayagraj, U.P., India. His main research areas are wireless sensor network, cryptography, cloud computing and machine learning. He has published several papers in academic journals and international proceedings. He has served as a guest editor for special issues in several journals, program committee member for many conferences and chaired several conferences. He also organized several national/international workshops and conferences. Dharma P. Agrawal has been the OBR Distinguished Professor at the University of Cincinnati, since August 1998. He is co-author of textbooks Introduction to Wireless and Mobile System (4th edition) , and Ad hoc and Sensor Networks (2nd edition), co-edited Encyclopedia on Ad Hoc and Ubiquitous Computing, and Embedded Sensor Systems. He is the Fellow of IEEE, ACM, AAAS, NAI, IACSIT, and WIF. He is a Golden Core member of the IEEE-CS and recipient of the IEEE Third Millennium Medal. He has published over 684 articles, 42 keynote speeches, 67 intensive courses, 8 patents and 25 invention disclosures, supervised 75 Ph.D. dissertations and led UCBT Bluetooth package. He h