Cooling of Discrete Heat Sources under Natural and Mixed Convection - Image 1

£64.00

LAP Lambert Academic Publishing Cooling of Discrete Heat Sources under Natural and Mixed Convection

Name: Cooling of Discrete Heat Sources under Natural and Mixed Convection
Brand: LAP Lambert Academic Publishing
Price: 64.0 GBP
Availability: InStock

Engineering & Technology

Price data last checked 10 day(s) ago - will refresh soon

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

It has never been this cheap. We have no record of a lower price.

£64 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 81 days · 81 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 81 days • 1 price levels

Days at Price

Price Analysis

Most common price: £64 (81 days, 100.0%)

Price range: £64 - £64

Price levels: 1 different prices over 81 days

Description

Due to rapid advancement in integrated circuit technology, and increasing power dissipation, thermal management of electronics has become increasingly challenging. For reliable operation of electronic components, their operating temperature must not exceed about 85ºC. As the size of electronic components becomes smaller and smaller, the area available for heat dissipation also becomes smaller. This results in a dissipation of high heat flux at the chip level, thereby necessitating the development of more efficient thermal management solutions. In view of the above, it is imperative to seek the optimal distribution of heat sources mounted on a PCB, to improve the cooling rate, and thereby their reliability, and life. Discrete heat sources are individual heating elements mounted on the motherboard of computers. Often times, the PCB (FR4) is mimicked by a low thermal conductivity material, Bakelite, and the discrete heat sources or IC chips, usually made of Silicon by Aluminum. The main objective of this present study is to seek the optimal configuration of discrete heat sources mounted on the PCB board losing heat by convection and radiation.

Product Specifications

Brand: LAP Lambert Academic Publishing
Format: paperback
ASIN: 6200093555
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology
Domain: Amazon UK
Release Date: 13 May 2019
Listed Since: 06 June 2019

Barcode

No barcode data available

LAP Lambert Academic Publishing Cooling of Discrete Heat Sources under Natural and Mixed Convection

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Thermal Management in Electronic Component using Jet Impingement: Thermal optimization

Fluid Flow, Heat Transfer and Boiling in Micro-Channels (Heat and Mass Transfer)

Electronics Cooling: From the Chip to the Datacenter (Volume 62) (Advances in Heat Transfer, Volume 62)

Heat Convection in Micro Ducts: 11 (Microsystems, 11)

Heat Transfer Augmentation in a Semiconductor Device

Thermal and Power Management of Integrated Circuits (Integrated Circuits and Systems)

Natural Convection Heat Transfer from Enclosed Helical Coils: An experimental study of natural convection heat transfer from enclosed helical coils in vertical orientation

Mathematical optimisation: Design of optimal micro heat sinks: Optimisation of Microchannels and Micropin-fin Heat Sinks with CFD in Combination with an Optimisation Algorithm

Thermal Testing of Integrated Circuits

Bias-Temperature-Instabilities in MOSFETs with high-k dielectrics: Electrical behavior, modeling and process impact under Bias Temperature stress in high-k metal gated MOSFETs

A Dew Point Air Cooler toward Super Performance: From conception, simulation, fabrication to laboratory testing and applied evaluation

Heat Conduction: Lumped Analysis, Integral Transforms, Symbolic Computation

THERMO-DIFFUSION AND DIFFUSION-THERMO EFFECTS ON BOUNDARY LAYER FLOWS: THERMO-DIFFUSION AND DIFFUSION-THERMO EFFECTS ON FREE CONVECTIVE BOUNDARY LAYER FLOWS

Energy Limits in Computation: A Review of Landauer’s Principle, Theory and Experiments

Walters-B Viscoelastic Flow Past a Vertical Plate: Numerical Study of Unsteady Free Convective Heat and Mass Transfer in a Walters-B Viscoelastic Flow Past a Vertical Plat

The Simulation of Thermomechanically Induced Stress in Plastic Encapsulated IC Packages

Heat Transfer: Convection,Heat Exchangers,Radiation

Advanced Thermal Management Materials

Thermal Transport in Microchannels: Single-phase and two-phase fluid flow and heat transfer

Heteroclinic cycles in thermal convection models: Bifurcation analysis and numerical investigations

Heat Transfer of Laminar Mixed Convection of Liquid (Heat and Mass Transfer)

UNSTEADY MHD HEAT AND MASS TRANSFER FLOW: THROUGH A PLATE IN POROUS MEDIUM IN THE PRESENCE OF CHEMICAL REACTION AND HEAT ABSORPTION

Performance Evaluation of Thermoelectric Modules: An Analytical Approach using Effective Material Properties

Dynamic Modeling of Arc Discharge on Ice-covered Insulators: Performance of High Voltage Insulators in Cold Environments