Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry - Image 1

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VDM Verlag Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry

Name: Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry
Brand: VDM Verlag
Price: 54.95 GBP
Availability: InStock

Engineering & Technology

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Brand: VDM Verlag
Format: paperback
ASIN: 3639133277
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology
Domain: Amazon UK
Release Date: 15 March 2009
Listed Since: 26 March 2009

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VDM Verlag Study of SnAgCu Alloy Reliability: Material Microstructural Evolution and Laser Moire Interferometry

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