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VDM Verlag Frei applizierbare MOSFET-Sensorfolie zur Dehnungsmessung

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Description
Während die Integrationsdichte von Halbleiterchips rasant fortgeschritten ist und fortschreitet, fällt der Miniaturisierungsgrad in der Aufbau- und Verbindungstechnik (AVT) vergleichsweise schwach aus. Ein Ansatz zur Erhöhung der AVT-Packungsdichte ist die Verwendung biegsamer Chips. Schlüssel zu einer sicheren Biegsamkeit ist die Fähigkeit, bruchsichere dünne Chips mit funktionstüchtigen Halbleiterbauelementen zu fertigen. Durch die Kombination von gedünnten Chips und flexiblen Polymersubstraten eröffnet sich insbesondere die Möglichkeit der Entwicklung von dicht gepackten Sensorfolien, also an dreidimensionale Oberflächen applizierbaren Sensorarrays. Diese Arbeit begreift sich als ein Beitrag zur Untersuchung von dünnen CMOS-Chips sowohl hinsichtlich der Bruchsicherheit als auch hinsichtlich des elektrischen Verhaltens von MOSFETs. Die dabei gewonnen Kenntnisse wurden für die Entwicklung einer MOSFET-Sensorfolie angewandt.

Product Specifications
Brand
VDM Verlag
Format
paperback
ASIN
363900857X
Category
Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering
Domain
Amazon UK
Release Date
13 May 2008
Listed Since
23 March 2010

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No barcode data available

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