Springer Circadian Rhythms for Future Resilient Electronic Systems: Accelerated Active Self-Healing for Integrated Circuits

This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level.  The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery.  Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.   Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT. From the Back Cover This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level.  The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery.  Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.   Presents novel techniques, tested with experiments on real hardware; Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow; Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems; Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both; Includes coverage of resilient aspects of emerging applications such as IoT. About the Author Xinfei Guo is a Design Engineer in Semiconductor industry in US. He received his Ph.D. degree in Computer Engineering from the University of Virginia in May 2018. He also held a M.S. degree in Electrical and Computer Engineering from the University of Florida, Gainesville, FL, in 2012 and a B.S. degree in Microelectronics from Xidian University, Xi’an, China, in 2010. He has broad interests in digital circuit and microarchitectures. His research focused on Reliability (Wearout and Accelerated Recovery Techniques), Cross-layer power and reliability co-design methodology, Low-power and Energy-efficient digital design. He is a student member of the IEEE and ACM, and a recipient of the 2017 IEEE Circuits and Systems (CAS) Pre-Doctoral Scholarship. He also received the Best Paper Awards at SRC TECHCON 2017 and SELSE 2017, and received Louis T. Radar Graduate Research Award from ECE department and A. Richard Newton Young Student Fellowship from DAC 2013. He has published and co-authored more than 20 peer-reviewed papers and has served as an active reviewer for various IEEE/ACM conferences and journals, such as DAC, ISCAS, ICCD, ISVLSI, ICCAD, TCAS I and II, TVLSI, TCAD, D & T, etc. He is also a Featured Reviewer for ACM Computing Reviews and served as the conference committee for various conferences such as ISVLSI, NOCs, ASAP, PRIME, etc. Mircea R. Stan received the Ph.D. (1996) and the M.S. (1994) degrees in Electrical and Computer Engineering from the University of Massachusetts at Amherst and the Diploma (1984) in Electronics and Communications from Politehnica University in Bucharest, Romania. Since 1996 he has been with the Charles L. Brown Department of Electrical and Computer Engineering at the University of Virginia, where he is now a professor. Professor Stan is teaching and doing research