£115.00

Reliability, Testing, and Characterization of MEMS/MOEMS III (Proceedings of SPIE)

Applied Optics

Price data checked 5 days ago

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

It has never been this cheap. We have no record of a lower price.

£115 today · cheaper than every other day in the last 3 months

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 86 days • 86 data points (No recent data available)

Historical

Generating forecast...

Price Distribution

Price distribution over 86 days • 1 price levels

Days at Price

Price Analysis

Most common price: £115 (86 days, 100.0%)

Price range: £115 - £115

Price levels: 1 different prices over 86 days

Product Specifications

Format: paperback
ASIN: 0819452513
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Electronics & Communications Engineering > Electronics Engineering > Applied Optics
Domain: Amazon UK
Release Date: 23 December 2003
Listed Since: 31 December 2006

Barcode

No barcode data available

Reliability, Testing, and Characterization of MEMS/MOEMS III (Proceedings of SPIE)

It has never been this cheap. We have no record of a lower price.

Price History & Forecast

Price Distribution

Price Analysis

Product Specifications

Barcode

Similar Products You Might Like

MEMS/MOEMS Components and Their Applications (Proceedings of SPIE)

Microelectronics: Design, Technology, and Packaging III: 3 (Proceedings of SPIE)

Advanced Topics in Optoelectronics, Microelectronics, and Nanotechnologies III (Proceedings of SPIE)

Reliability of Optical Fiber Components, Devices, Systems, and Networks III (Proceedings of SPIE)

Nanotechnology III (Proceedings of SPIE)

Nanoepitaxy: Materials and Devices III

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS V (Proceedings of SPIE)

MOEMS Display and Imaging Systems II (Proceedings of SPIE)

Smart Sensors, Actuators, and Mems VI (Proceedings of SPIE)

Nanophotonics for Communication: Materials, Devices, and Systems III (Proceedings of SPIE)

Advanced Sensor Systems and Applications III: 3 (Proceedings of SPIE)

Process and Materials Characterization and Diagnostics in IC Manufacturing: II (Proceedings of SPIE)

Sensors for Propulsion Measurement Applications (Proceedings of SPIE)

Nonimaging Optics and Efficient Illumination Systems: Pt. III (Proceedings of SPIE)

Photonics: Design, Technology, and Packaging III: 3 (Proceedings of SPIE)

Scattering and Surface Roughness III (SPIE Conference Proceedings) (Proceedings of Spie)

Intelligent Integrated Microsystems (Proceedings of SPIE)

Nanocoatings (Proceedings of SPIE)

Device and Process Technologies for Microelectronics, MEMS, and Photonics IV: 4 (Proceedings of SPIE)

Silicon Photonics (Proceedings of SPIE)

Organic Photovoltaics: III (Proceedings of SPIE)

Chemical and Biological Sensing: III (Proceedings of SPIE)

Nanoepitaxy: Materials and Devices V (Proceedings of SPIE)

Nanostructured Thin Films (Proceedings of SPIE)