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Springer Wafer Scale Integration - Technical Engineering Book

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Description

Explore the advanced concepts of semiconductor design with Wafer Scale Integration by Springer. This technical resource examines the evolution of integrated circuits, moving beyond traditional VLSI methods to explore the potential of entire wafers as single systems. While standard VLSI chips involve fabricating hundreds of identical circuits on a single wafer before dicing and packaging, Wafer Scale Integration offers a different approach. This book details how wafers are fabricated with multiple types of circuits, known as cells, which are tested and interconnected to create a functional system on the wafer itself. Because most signal lines remain on the wafer, this method results in low stray capacitance, allowing for high speeds. This text is an essential study for those interested in the quest for larger integrated circuits and the technical methods used to realize complex systems on a wafer scale.

Key Features

Used Book in Good Condition - This copy is well-maintained and suitable for academic study or professional reference.

Technical Analysis of WSI - Learn how cells are tested and interconnected to realize a complete system on a single wafer.

Comparison to VLSI - Understand the fundamental differences between standard VLSI fabrication and Wafer Scale Integration methods.

High Speed Performance Insights - Discover how keeping signal lines on the wafer reduces stray capacitance to achieve higher speeds.

Expert Publication - Published by Springer, a trusted name in technical and scientific literature.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
31 March 1989
Listed Since
16 February 2007

Barcode

No barcode data available

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