Structural Analysis in Microelectronics and Fiber Optics: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997 (EEP)

Recent Advances in Solids/Structures and Application of Metallic Materials: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997 (PVP)

Polymeric Materials for Microelectronics and Photonics Applications: Mechanics Physics Reliability Processing

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... Physical Design - Reliability and Packaging

Springer

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging: Volume I Materials Physics - Materials ... ... Physical Design - Reliability and Packaging

Springer

Proceedings of the ASME ASME 2007 International Manufacturing Science and Engineering Conference (MSEC2007): October 15 - 18, 2007 in Atlanta, Georgia, USA

Structural Analysis of Printed Circuit Board Systems (Mechanical Engineering Series)

Springer

Electronic and Photonics Packaging, Electrical Systems Design and Photonics, and Nanotechnology

Proceedings of the ASME Aerospace Division: International Mechanical Engineering Congress and Exposition, Atlanta, Georgia, November 17-22, 1996 (Aerospace Division AD - Proceedings)

Proceedings of the Third International Conference on Theoretical, Applied and Experimental Mechanics: 16 (Structural Integrity, 16)

Packaging of Electronic & Photonic Devices: Presented at the 2000 Asme International Mechanical Engineering Congress and Exposition, November 5-10, 2000, Orlando, Florida (Eep (Series), Vol. 28.)

Thermal Stress and Strain in Microelectronics Packaging

Springer

Micromechanics of Composite Materials: 186 (Solid Mechanics and Its Applications, 186)

Springer

Tribology Issues and Opportunities in MEMS: Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS held in Columbus, Ohio, U.S.A., 9–11 November 1997

Springer

Flexible Electronics: Theory and Method of Structural Design

Springer

Microoptics: From Technology to Applications: 97 (Springer Series in Optical Sciences, 97)

Springer

Electronics and Photonics Packaging, Electrical Systems and Photonic Design, and Nanotechnology

Tribology Issues and Opportunities in MEMS: Proceedings of the NSF/AFOSR/ASME Workshop on Tribology Issues and Opportunities in MEMS held in Columbus, Ohio, U.S.A., 9–11 November 1997

Springer

Proceedings of the ASME Fifth International Conference on Nanochannels, Microchannels and Minichannels (ICNMM2007): June 18 - 20, 2007 in Puebla, Mexico

Thermal Management of Microelectronic Equipment (Electronic Packaging): Heat Transfer Theory, Analysis Methods, and Design Practices

ASME Press

Mechanics of Auxetic Materials and Structures (Emerging Materials and Technologies)

Experimental Analysis of Nano and Engineering Materials and Structures: Proceedings of the 13th International Conference on Experimental Mechanics, Alexandroupolis, Greece, July 1-6, 2007

Springer

Proceedings of the Third International Conference on Theoretical, Applied and Experimental Mechanics: 16 (Structural Integrity, 16)

Springer

Mechanics of Microelectronics: 141 (Solid Mechanics and Its Applications, 141)

Springer

Wiley Quality Conformance of Microelectronic Packages Book

Wiley