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Structural Analysis in Microelectronics and Fiber Optics: International Mechanical Engineering Congress and Exposition, Dallas, Texas, November 16-21, 1997 (EEP)

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Description

A selection of 16 papers applying theoretical and experimental methods of structural analysis and engineering mechanics to various mechanical, materials, and manufacturing problems in microelectronics and photonics. Among the topics are assessing chip-scale package design options, the experimental e

Product Specifications

Format
paperback
Domain
Amazon UK
Release Date
15 November 1997
Listed Since
09 December 2006

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