Springer Foldable Flex and Thinned Silicon Multichip Packaging

Explore the next frontier of semiconductor design with Foldable Flex and Thinned Silicon Multichip Packaging Technology. Published by Springer, this technical resource examines emerging methods for creating stacked chip packages through 2-1/2 D technology. This specific approach provides a 3-D physical format while maintaining interconnection through circuits on folded flex substrates. This text covers how these methods are applied to single chip packages. By utilizing the thinness of both the chips and the flex substrate, engineers can create packages that are significantly thinner than those produced through traditional means. It serves as a vital reference for those studying advanced packaging and the evolution of semiconductor manufacturing processes.