£99.80

World Scientific Publishing Company Embedded Cooling of Electronic Devices - World Scientific

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Description

Explore specialized thermal management solutions in Embedded Cooling of Electronic Devices. This volume, part of the WSPC Series in Advanced Integration and Packaging, focuses on the essential processes of conduction, evaporation, and both single- and two-phase convection. Published by World Scientific Publishing Company, this technical resource provides deep insights into the mechanics required to manage heat in modern electronic systems. It serves as a professional reference for those studying or working within the fields of engineering and advanced packaging technology. By examining various heat transfer methods, the text supports a technical understanding of how to maintain stability in integrated electronic components. This book is a valuable addition to any professional or academic library focused on the intersection of science, engineering, and advanced technology.

Key Features

Comprehensive coverage of conduction and evaporation methods for electronic cooling.

Technical analysis of single-phase and two-phase convection processes.

Part of the professional WSPC Series in Advanced Integration and Packaging.

Published by World Scientific Publishing Company for academic and professional use.

Focused on the engineering principles of thermal management in electronic devices.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
22 January 2024
Listed Since
09 June 2023

Barcode

No barcode data available

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