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World Scientific Publishing Company Embedded Cooling of Electronic Devices - Engineering Guide

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£99.80 £94.81 £96.81 £98.80 £100.80 £102.79 £104.79 26 July 2026 16 August 2026 06 September 2026 27 September 2026 18 October 2026
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Description

Embedded Cooling of Electronic Devices explores advanced thermal management techniques essential for modern electronics and computing systems. This comprehensive volume from the WSPC Series in Advanced Integration and Packaging examines conduction, evaporation, and both single- and two-phase convection methods for controlling heat in embedded systems. The book provides engineers and researchers with in-depth analysis of cooling mechanisms critical for maintaining device performance and reliability. Covering thermal transport phenomena and practical cooling solutions, this technical reference addresses the growing demand for efficient heat dissipation in densely integrated electronic components. Ideal for professionals in electrical engineering, mechanical engineering, and semiconductor design who need to understand and implement advanced cooling strategies in their applications.

Key Features

Part of the WSPC Series in Advanced Integration and Packaging, ensuring peer-reviewed academic rigour and industry relevance.

Covers conduction, evaporation, and single-phase convection cooling methods for comprehensive thermal management knowledge.

Includes two-phase convection analysis, addressing modern high-performance cooling requirements for embedded electronics.

Published by World Scientific Publishing Company, a leading academic publisher in engineering and technology fields.

Provides practical solutions for thermal management in integrated circuit design and electronic packaging applications.

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