We can't find the internet
Attempting to reconnect
Something went wrong!
Hang in there while we get back on track
£135.00
CRC Press - Through Silicon Vias: Materials, Models, Design
Price data checked 6 days ago
We'll watch every seller, every day. One email when your price arrives.
It has never been this cheap. We have no record of a lower price.
£135 today · cheaper than every other day in the last 3 months
NEW HERE?
Amazon shows you one price. We show you all of them.
Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.
WHAT'S ON THIS PAGE
when this has been cheap or pricey
where the price is heading next
all-time high & low, recent range
name your number, we'll email you
Price History & Forecast
Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.
Last 85 days • 85 data points (No recent data available)
Price Distribution
Price distribution over 85 days • 2 price levels
Price Analysis
Most common price: £135 (70 days, 82.4%)
Price range: £135 - £143
Price levels: 2 different prices over 85 days
Description
Key Features
Comprehensive review of TSV theory and recent semiconductor technology advancements.
Detailed coverage of modern materials, models, and design methods for vertical interconnect access.
Provides electrical equivalent models for Cu, carbon nanotube (CNT), and graphene nanoribbon (GNR) based TSVs.
Includes performance comparisons between Cu, CNT, and GNR based TSVs based on electrical models.
Explores how different geometries and physical configurations impact TSV performance.
Product Specifications
- Brand
- CRC Press
- Format
- hardcover
- ASIN
- 1498745520
- Domain
- Amazon UK
- Release Date
- 06 September 2016
- Listed Since
- 16 February 2016
Barcode
No barcode data available
Similar Products You Might Like
Circuit Design Techniques for Non-Crystalline Semiconductors
CRC Press
3D TCAD Simulation for Semiconductor Processes, Devices and Optoelectronics
Springer
Recent Advances in VLSI Design
Clanrye International
Advanced Theory of Semiconductor Devices
Wiley
Future Trends in Microelectronics: Journey into the Unknown
Wiley
Granular Nanoelectronics: 251 (NATO Science Series B:, 251)
Springer
Silicon and Silicide Nanowires: Applications, Fabrication, and Properties
Taylor & Francis
Innovative Applications of Nanowires for Circuit Design (Advances in Computer and Electrical Engineering (Acee))
Innovative Applications of Nanowires for Circuit Design
High-Speed Electronics and Optoelectronics: Devices and Circuits
Cambridge University Press
Fundamentals of Modern VLSI Devices
Cambridge University Press
Analysis and Simulation of Heterostructure Devices (Computational Microelectronics)
Springer
III–V Compound Semiconductors and Devices: An Introduction to Fundamentals (Graduate Texts in Physics)
Springer
VLSI Circuit Design Methodology Demystified: A Conceptual Taxonomy
Wiley-IEEE Press
Guide to Semiconductor Engineering
World Scientific Publishing Company
Modeling And Electrothermal Simulation Of SiC Power Devices: Using Silvaco© Atlas
Scientific Publishing
Advanced Nanoelectronics (Nano and Energy)
CRC Press
Introduction to Nanoelectronic Single-Electron Circuit Design
Taylor & Francis
Advanced Nanoelectronics: 4 (Nano and Energy)
CRC Press
TSV 3D RF Integration: High Resistivity Si Interposer Technology
Elsevier
Handbook of Semiconductor Interconnection Technology
CRC Press
Springer - The Physics of Instabilities in Solid State Electron Devices
Springer
Silicon Heterostructure Handbook: Materials, Fabrication, Devices, Circuits and Applications of SiGe and Si Strained-Layer Epitaxy
CRC Press
3D IC Integration and Packaging (ELECTRONICS)
McGraw-Hill Education