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£135.00
CRC Press - Through Silicon Vias: Materials, Models, Design
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Description
Key Features
Comprehensive review of TSV theory and recent semiconductor technology advancements.
Detailed coverage of modern materials, models, and design methods for vertical interconnect access.
Provides electrical equivalent models for Cu, carbon nanotube (CNT), and graphene nanoribbon (GNR) based TSVs.
Includes performance comparisons between Cu, CNT, and GNR based TSVs based on electrical models.
Explores how different geometries and physical configurations impact TSV performance.
Product Specifications
- Brand
- CRC Press
- Format
- hardcover
- ASIN
- 1498745520
- Category
- Books > Subjects > Computing & Internet > Computer Science > Architecture & Microprocessors
- Domain
- Amazon UK
- Release Date
- 06 September 2016
- Listed Since
- 16 February 2016
Barcode
No barcode data available
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