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£110.00
Institution of Engineering & Technology Thermomechanical Simulation Methodologies for Advanced Semiconductor Packaging (Materials, Circuits and Devices)
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Last 33 days • 33 data points (No recent data available)
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Price distribution over 33 days • 1 price levels
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Most common price: £110 (33 days, 100.0%)
Price range: £110 - £110
Price levels: 1 different prices over 33 days
Product Specifications
- Format
- hardcover
- ASIN
- B0DW7TLDN8
- Domain
- Amazon UK
- Release Date
- 20 May 2025
- Listed Since
- 06 February 2025
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