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£109.99
Springer Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Description
Product Specifications
- Brand
- Springer
- Format
- paperback
- ASIN
- 9819641683
- Domain
- Amazon UK
- Release Date
- 19 May 2026
- Listed Since
- 20 June 2026
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