Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration - Image 1

£132.30

Springer Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration

Name: Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
Brand: Springer
Price: 132.3 GBP
Availability: InStock

Chemistry

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Product Specifications

Brand: Springer
Format: hardcover
ASIN: 9819641659
Category: Books > Subjects > Science, Nature & Maths > Chemistry
Domain: Amazon UK
Release Date: 19 May 2025
Listed Since: 29 January 2025

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