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£132.59
Springer Hybrid Bonding, Advanced Substrates, Failure Mechanisms, and Thermal Management for Chiplets and Heterogeneous Integration
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Product Specifications
- Brand
- Springer
- Format
- hardcover
- ASIN
- 9819641659
- Domain
- Amazon UK
- Release Date
- 19 May 2025
- Listed Since
- 29 January 2025
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