£125.00

World Scientific Publishing Company EMBEDDED DIELECTRICS FOR ELECTRONIC PACKAGING: 0 (WSPC SERIES IN ADVANCED INTEGRATION AND PACKAGING)

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Description

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

Product Specifications

Format
hardcover
Domain
Amazon UK
Release Date
30 January 2017
Listed Since
05 September 2014

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