Springer Next Generation Materials and Processing Technologies: Select Proceedings of RDMPMC 2020: 9 (Springer Proceedings in Materials, 9)

Product Description This book presents the select proceedings of Conference on Research and Developments in Material Processing, Modelling and Characterization (RDMPMC 2020). It highlights the new technologies developed in the generation of rational materials for various applications with tailored properties. It covers fundamental research in emerging materials which includes biomaterials, composites, ceramics, functionally graded materials, energy materials, thin film materials, nanomaterials, nuclear materials, intermetallic, high strength materials, structural materials, super alloys, shape memory alloys and thermally enhanced materials. It includes the numerical modeling and computer simulation to investigate the properties and structure of materials. Few of the most relevant manufacturing techniques highlighted in this book are welding, coating, additive manufacturing, laser-based manufacturing, advanced machining processes, casting, forming and micro and nanoscale manufacturing processes. Given its contents, this book is beneficial to students, researchers and industry professionals.  From the Back Cover This book presents the select proceedings of Conference on Research and Developments in Material Processing, Modelling and Characterization (RDMPMC 2020). It highlights the new technologies developed in the generation of rational materials for various applications with tailored properties. It covers fundamental research in emerging materials which includes biomaterials, composites, ceramics, functionally graded materials, energy materials, thin film materials, nanomaterials, nuclear materials, intermetallic, high strength materials, structural materials, super alloys, shape memory alloys and thermally enhanced materials. It includes the numerical modeling and computer simulation to investigate the properties and structure of materials. Few of the most relevant manufacturing techniques highlighted in this book are welding, coating, additive manufacturing, laser-based manufacturing, advanced machining processes, casting, forming and micro and nanoscale manufacturing processes. Given its contents, this book is beneficial to students, researchers and industry professionals.  About the Author Dr. Swarup Bag completed his Bachelors of Engineering in Mechanical Engineering from the Jalpaiguri Government Engineering College, Jalpaiguri, West Bengal, India, in the year 2000, M.E. in Mechanical Engineering in 2002 from Bengal Engineering College, Shibpur, India (now Indian Institute of Engineering Science and Technology), in the year 2002, and Ph.D. on “Development of Bi-directional Heat Transfer and Fluid Flow Model for Reliable Design of GTA and Laser Welding Processes” in 2009 from IIT Bombay. Later he has worked at the Center for Material Forming (CEMEF), MINES Paris Tech, France, for 20 months in Metallurgy, Structure and Rheology (MSR) group. In the year 2011, he joined the Department of Mechanical Engineering, Indian Institute of Technology Guwahati, as a faculty member. He worked as a visiting scholar at Center for Advanced Materials Joining, University of Waterloo, Canada, from May 2018 to July 2018. His primary area of research is fundamental process modeling of welding and joining technologies, optimization of manufacturing processes and recrystallization in metal forming processes. Dr. Bag has published about 50 journal papers, 50 conference papers and 10 book chapters related to welding and joining processes. He is the author of the book “Computational models for GTA and laser welding processes” and the recipient of “Royal Arc Award 2009” from Indian Institute of Welding for the best Ph.D. thesis in welding. Till now, five students have received doctorate degree and seven research scholars are working under his guidance. Thirteen M.Tech. projects and 11 B.Tech. projects have completed so far. Two research projects have completed so far in his credit.    Dr. C P Paul is leadi