HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS - Image 1

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LAP Lambert Academic Publishing HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS

Name: HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS
Brand: LAP Lambert Academic Publishing
Price: 70.0 GBP
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Engineering & Technology

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Description

In any structural component where load path is diverted due to a change in section, i.e. a delaminated composite component, an adhesively bonded joint or ply drop-offs, and where out-of- plane stresses are induced, component surface displacements will occur. These out-of-plane surface displacements although relatively small, are indicative of internal structural problems that can be associated with component strength capacity limitations. This book discusses the application of a portable holographic interferometry testing system (PHITS) to study micro-deformations of a surface in a wide range of structural defects. The defects covered include delaminations, matrix cracks and matrix degradation due to heat, peel displacement behaviour in bonded lap-joints, debonded and weak bondlines. The results of this optical investigation have extended structural behaviour and mechanics understanding in all of the defect interaction.

Product Specifications

Brand: LAP Lambert Academic Publishing
Format: paperback
ASIN: 3838322002
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology
Domain: Amazon UK
Release Date: 14 April 2010
Listed Since: 20 April 2010

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LAP Lambert Academic Publishing HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS

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LAP Lambert Academic Publishing HOLOGRAPHIC INTERFEROMETRY ASSESSMENT: IN COMPOSITE AND ADHESIVELY BONDED STRUCTURAL DEFECTS

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Price Distribution

Price Analysis

Description

Product Specifications

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