£73.12

Heat Conduction in Filled Polymers Experimental and Simulative Investigations on Microscopic Heat Transport and Particle-Level Phenomena

Science, Nature & Maths

Price data last checked 17 day(s) ago - will refresh soon

View at Amazon

We'll watch every seller, every day. One email when your price arrives.

This is the most expensive it has ever been. Walk away.

£73 today · previous high £73 · all-time low £73

NEW HERE?

Amazon shows you one price. We show you all of them.

Tosheroon watches Amazon prices so you don't have to. Every product on Amazon has a price history — we make it visible. Set the price you'd actually pay, and we'll email you the second it gets there. No app, no account, one email.

WHAT'S ON THIS PAGE

↓ Price chart
when this has been cheap or pricey

↓ Forecast
where the price is heading next

↓ Statistics
all-time high & low, recent range

↑ Price alert
name your number, we'll email you

Price History & Forecast

Grey patches = out of stock. Cheaper = lower on the chart. Hover for exact prices.

Last 74 days · 4 data points (no recent data)

Historical

Generating forecast…

Price Distribution

Price distribution over 74 days • 1 price levels

Days at Price

Price Analysis

Most common price: £73 (4 days, 100.0%)

Price range: £73 - £73

Price levels: 1 different prices over 4 days

Description

Thermally conductive filled polymers are widely used in micro and power electronics as well as in electromobility. They have a highly complex and heterogeneous microstructure. The present work describes the development and application of experimental and simulative methods to investigate the microscopic heat transport through filled polymers and across filled polymer to substrate transitions. The aim is to develop a comprehensive understanding of the effects of various polymer, filler, and substrate properties on the effective thermal conductivity and on thermal contact resistance between filled polymers and solid surfaces. Experimental studies are carried out using the steady-state cylinder method and a newly developed technique based on micro thermography. This enables microscopic resolution of the thermal contact resistances, providing insight into the mechanisms in filled polymer to substrate transitions that were previously unattainable. In addition, microstructure simulation models assist the investigation into the processes inside the materials that cannot be resolved experimentally. The simulative investigations also allow an isolated analysis of individual influencing variables, which is only possible to a limited extent experimentally due to the versatile property profiles of available fillers. The geometrically detailed microstructure models can be constructed based on measurable material properties such as particle shape plus size distribution or surface structure of a substrate and thus reconstruct the structure of real sample materials. Generally, the effect of the microscopic packing structure is more significant than that of the thermal properties of polymer, filler, and substrate. Particle morphology, size distribution, packing compaction and phenomena such as agglomeration and sedimentation define how well thermally conductive paths are formed in the material and which filler volume fractions are necessary to achieve the desired effect

Product Specifications

Format: paperback
ASIN: 3689523893
Category: Books > Subjects > Science, Nature & Maths
Domain: Amazon UK
Release Date: 12 November 2025
Listed Since: 10 December 2025

Barcode

No barcode data available

Heat Conduction in Filled Polymers Experimental and Simulative Investigations on Microscopic Heat Transport and Particle-Level Phenomena

This is the most expensive it has ever been. Walk away.

Price History & Forecast

Price Distribution

Price Analysis

Description

Product Specifications

Barcode

Similar Products You Might Like

Modelling of Thermo-Electro Hydrodynamic (TEHD) convection

Polymers Physics: From Theory to Experimental Applications

Microfabrication of Stimuli-Responsive Polymers

Non-Fourier Heat Conduction: From Phase-Lag Models to Relativistic and Quantum Transport

Modelling of Convective Heat and Mass Transfer in Nanofluids with and without Boiling and Condensation (Mathematical Engineering)

Multiphysics in Porous Materials

Experimental Analysis and Modeling of Oil Droplet Formation and Rise Behavior under Deep-Sea Conditions

Sustainable Energy Materials and Numerical Investigation of Heat and Mass Transfer Processes

An Overview of Heat Transfer Phenomena

Heat Transfer: Design, Experimentation and Applications

Heat Transfer Phenomena & Applications

Nanocarbon-Based Composites and Their Thermal, Electrical, and Mechanical Properties

Flow boiling and condensation in microscale channels (Mechanical Engineering Series)

Carbon Nanotubes: Polymer Nanocomposites

Vibration and Heat Transfer of Elastic Tube Bundles in Heat Exchangers: A Numerical Study

Vibration and Heat Transfer of Elastic Tube Bundles in Heat Exchangers: A Numerical Study

Heat Transfer Enhancement Inside Tubes Using Inserted Helical coils: convection heat transfer in a tube with inserted helical coils

Developments in Heat Transfer

Experimental, Theoretical, Numerical and Big-Data-Based Investigations on Characterizations for Geomaterials

Micromechanics of Heterogeneous Materials

Weathering of Polymers and Plastic Materials

Nanophotonic Materials (Proceedings of SPIE)

Radiative Heat Transfer in Participating Media: With MATLAB Codes

Polymers Synthesis and Characterization