Springer Advancement of Optical Methods in Experimental Mechanics, Volume 3: Proceedings of the 2016 Annual Conference on Experimental and Applied Mechanics ... Society for Experimental Mechanics Series)

Product Description Advancement of Optical Methods in Experimental Mechanics, Volume 3 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the third volume of ten from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas:  Advances in Digital Image Correlation Challenging Applications of DIC Uncertainty Analysis & Improvements to DIC Accuracy Photoelasticity, Interferometry, & Moire Methods Applications of Stereovision Inverse Methods at High Strain Rates Inverse Methods in Plasticity From the Back Cover Advancement of Optical Methods in Experimental Mechanics, Volume 3 of the Proceedings of the 2016 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the third volume of ten from the Conference, brings together contributions to this important area of research and engineering.  The collection presents early findings and case studies on a wide range of optical methods ranging from traditional photoelasticity and interferometry to more recent DIC and DVC techniques, and includes papers in the following general technical research areas:  Advances in Digital Image Correlation Challenging Applications of DIC Uncertainty Analysis & Improvements to DIC Accuracy Photoelasticity, Interferometry, & Moire Methods Applications of Stereovision Inverse Methods at High Strain Rates Inverse Methods in Plasticity About the Author Prof. Sanichiro Yoshida―Southeastern Louisiana University, USA; Prof. Luciano Lamberti -Politecnico di Bari, Italy; Prof. Cesar A. Sciammarella – Illinois Institute of Technology, USA