Woodhead Publishing Microjoining and Nanojoining (Series in Welding and Other Joining Technologies)

Many recent advances in technology have been associated with nanotechnology and the miniaturization of components, devices and systems of electronic, precision and medical products. Among the key technical prerequisites, effective microjoining plays an essential role. Microjoining, having been closely associated with the evolution of microelectronic packaging, covers a much broader area, and is essential for manufacturing many electronic, precision and medical products. The first part of the book reviews the basics of microjoining and part two covers microjoining processes. A third group of chapters discusses microjoining of materials and a final group of chapters analyses the applications of microjoining. Key Features: reviews the basics of nanojoining including solid-state bonding and fusion microwelding; covers microjoining and nanojoining processes such as bonding mechanisms and metallurgy, sensing and numerical modelling; examines applications of microjoining such as the manufacturing of medical devices, and the sealing of solid oxide fuel cells; a valuable reference for production engineers, designers and researchers. Contents: Part 1 Basics of microjoining: Mechanisms of solid-state bonding; Mechanisms of soldering and brazing; Mechanisms of fusion microwelding; Modelling of solid-state bonding; Modelling of fusion microwelding; Sensing, monitoring and control; Assembly process automation and materials handling. Part 2 Microjoining and nanojoining processes: Microelectronics wire bonding; Solid-state diffusion bonding; Bonding using nanoparticles; Diffusion soldering and brazing; Laser soldering; Fluxless soldering; Laser microwelding; Electron beam microwelding; Resistance microwelding; Adhesive bonding; Introduction to nanojoining. Part 3 Microjoining of materials and applications of microjoining: Joining of high temperature superconductors; Joining of shape memory alloys; Wafer bonding; Plastics microwelding; Microjoining in medical components and devices; Hermetic sealing of solid oxide fuel cells; Joining of bulk nanostructured materials; Ceramic/metal bonding.