Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156: Symposium Held April 14-17, 2009, ... California, U.s.a. (MRS Proceedings) - Image 1

£97.85

Cambridge University Press Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156: Symposium Held April 14-17, 2009, ... California, U.s.a. (MRS Proceedings)

Name: Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics 2009: Volume 1156: Symposium Held April 14-17, 2009, ... California, U.s.a. (MRS Proceedings)
Brand: Cambridge University Press
Price: 97.85 GBP
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Materials Science

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Description

Enabled by the development and introduction of new materials, the semiconductor industry continues to follow Moore's law into 32nm and 22nm technologies. Advanced interconnect structures require the use of porous dielectrics with further reduced k-values and even weaker mechanical properties, as well as much thinner metallization liners. In addition, the increasing resistivity of Cu at decreasing dimensions must be addressed in order to maintain the performance of continuously shrinking devices. To deal with these issues, and to maintain the reliability of the interconnects, innovations in materials, processes and architectures are needed. This book brings together researchers from around the world to exchange the latest advances in materials, processes, integration and reliability in advanced interconnects and packaging, and to discuss interconnects for emerging technologies. Papers from a joint session with Symposium F, Packaging, Chip-Package Interactions and Solder Materials Challenges, are also included and focus on 3D chip stacking and molecular electronics.

Product Specifications

Brand: Cambridge University Press
Format: hardcover
ASIN: 1605111295
Category: Books > Subjects > Science, Nature & Maths > Engineering & Technology > Mechanical & Materials Engineering > Materials Science
Domain: Amazon UK
Release Date: 18 November 2009
Listed Since: 30 March 2011

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Cambridge University Press Materials, Processes and Reliability for Advanced Interconnects for Micro- and Nanoelectronics ― 2009: Volume 1156: Symposium Held April 14-17, 2009, ... California, U.s.a. (MRS Proceedings)

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